Materials / Metals

Metal Etching

Meeting Requirements for High Accuracy, Low Cost, and Short Lead Times

Iwatani offers high-quality, high-accuracy components based on precision etching of stainless steel and nickel foils. Products can be etched on both sides, one side, or half-etched to suit particular requirements and applications.

Features

  • 1. Allows forming of complex shapes not possible with stamping
  • 2. Allows forming free of distortion and burrs
  • 3. Eliminates the need for molds, reducing initial costs
  • 4. Production and/or supply outside Japan possible, improving cost competitiveness

Product Details

Available Specifications

Processing Size Minimum sheet thickness 0.01 mm, width 1,000 mm * Varies by material.
Supplied Format Roll supply, sheet supply
Metal Materials SUS-CSP foil (e.g., 304, 301, 316L, non-magnetic SUS, TA treated material)
Copper based (e.g., oxygen-free copper, tough pitch copper, beryllium copper, high-strength copper alloy)
Nickel alloy (e.g., 42 alloy, pure nickel, Permalloy, Inconel)
High performance materials (e.g., titanium, nickel silver, tungsten, precious metals)
Etching Type Double-sided etching, single-sided etching, half etching
Secondary Processing Bending, corrosion proofing, coating, resin forming, etc.
  • *Specifications such as base material size, dimensional tolerances, and pitch tolerances vary depending on the material. Please inquire for more information.
  • *Processing is also possible for materials provided by the customer.

Typical Applications

● VCM spring for camera module

VCM spring for camera module

Base material: High-strength copper alloy, non-magnetic SUS foil

*Additionally. electrostatic grids and static eliminators for printers, organic EL metal masks, shield plates for camera modules, metal filters, metal masks for silicon wafers, etc.

Please inquire for more information.

Metals Department

Osaka
81-6-7637-3033

Tokyo
81-3-5405-5759

Contact Form

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