Materials / Electronic Materials
Thin Film Heat Dissipating Sheet
Thin Film Heat Dissipating Sheet With Ultra-Low Thermal Resistance
Thin film heat dissipating sheet offers ultra-low thermal resistance attributable to its thickness of 0.1 mm. Surface flexibility can be improved using special surface treatment to reduce boundary thermal resistance when installed in devices.
Product Characteristics
- 1. Heat dissipating sheet as thin as 0.1 to 0.2 mm realized, resulting in ultra-low thermal resistance when installed
- 2. Improved flexibility and low boundary thermal resistance, achieved through special surface treatment
- 3. Free of siloxane
- 4. Outstanding impact/vibration absorption, ideal even for impact absorption applications such as CPUs
- 5. Superior usability without the unevenness or thickness variation of grease
- 6. Thinness increases freedom of product and heat dissipation design
Major Applications
- IC chips for 5G communications stations and data centers
- IC chips for vehicle installation
- Heat dissipation for organic EL panels
Construction
Physical Properties
| Property | Units | Thin film heat dissipating sheet | ||
|---|---|---|---|---|
| Available thickness | μm | 100 to 200 | ||
| Density | g/cm3 | 1.0 | ||
| Thermal conductivity | Thickness direction | W/m･K | 1.7 | |
| Surface direction | W/m･K | 3.8 | ||
| Point impact absorption | % | 68.6 (100 μm) | 77.8 (200 μm) | |
| Asker C hardness | - | 45 | ||
Thermal Resistance Measurement Data
| Units | Thin film heat dissipating sheet | Competitor A’s product | Competitor B’s product | |
|---|---|---|---|---|
| Material | - | Acrylic | Acrylic | Silicone |
| Thickness | mm | 0.1 | 0.5 | 0.5 |
| Thermal conductivity | W/m･K | 1.64 | 3.0 | 6.5 |
| Thermal resistance ASTMD5470 |
cm2･K/W | 1.32 | 3.73 | 2.87 |
| Asker C hardness | - | 45 | 5 | 30 |
Offers higher heat dissipation than competing high thermal conductivity products
Please inquire for more information.
Electronic Materials Department
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