Cu-Fe Alloys

Iwatani Offers the World’s First Copper Iron Alloys to Allow Molten Iron Content of 4.0% To 10%

These alloys offer remarkable electrical conductivity, thermal conductivity, magnetism, and wear resistance characteristics, making them ideal for applications across a wide range of fields, including 5G/6G communication systems, AI/IoT, medicine/antibacterial uses, and vehicle-mounted equipment. Characteristics can be adjusted by varying the copper and iron content, allowing us to offer solutions to suit particular applications.

Features

1. Addresses the three major weaknesses of conventional Cu-Fe alloys (low electrical conductivity, reduced spring properties, yellow corrosion cracking)
2. 4.0% to 10% iron content exceeds 3.0%, the first time this has been achieved Conventionally, only up to 3.0% of iron was dissolvable in copper, but now 4.0% to 10% is possible (a world first).
3. Adjustable copper and iron content (Cu60:Fe40 to Cu95:Fe5)
4. Iron precipitation type alloy (performance provided from iron and copper independently)
5. Suitable for use for a wide range of products (e.g., pipes, sheet, foil, wire, powder)
6. Excellent processing characteristics (e.g., folding, bending, drawing, plating, laser processing)
7. Exceptional antibacterial properties (more powerful sterilizing/antibacterial properties than pure copper)

Typical Chemical Compositions

Alloy	Fe	Cr	Mn	Si	P	Cu
CuFe5	4.5 to 5.5	< 0.005	< 0.01	< 0.005	< 0.0015	Remainder
CuFe10	9.5 to 10.5	< 0.005	< 0.01	< 0.005	< 0.0015	Remainder

Typical Characteristics

Allow (strip)	Tensile Strength (MPa)	Elongation (%)	Hardness (HV)	Conductivity (lacs)	Thermal Conductivity (W/mK)
CuFe5 (1/4H)	350 to 420	> 15	100 to 135	> 65%	> 300
CuFe5 (H)	500 to 600	> 5	140 to 180	> 60%	> 300
CuFe10 (1/4H)	380 to 460	> 12	110 to 140	> 60%	> 170
CuFe10 (H)	550 to 650	> 4	150 to 190	> 55%	> 170

Applications

Welding materials	Welding wire and rings for arc welding Allows copper and steel (including SUS) to be welded, something not previously possible. Reduces costs when used as an alternative to silver solder.
High electrical conductivity spring material	Connectors, lead frames, switches, etc.
Heat dissipating material	Smartphones, 5G equipment, communications, electronic devices, etc.
Mold material	Super hard metals, regular molds
Shielding material	Stronger shielding than conventional copper braid
Electromagnetic material	IH electromagnetic devices, magnetic sensors, magnetic memory
Other	Radar equipment, normal temperature superconducting materials, etc.

Please inquire for more information.

Metals Department

Osaka
81-6-7637-3033

Tokyo
81-3-5405-5759

Contact Form

Typical Chemical Compositions

Typical Characteristics

Applications

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