Materials / Electronic Materials
Thermal-resistant UV release tape for dicing ISR-TR Series
260℃ heat resistant × UV release
This tape has excellent heat resistance required in dicing processes for semiconductors, LED chips, etc. After UV irradiation, the tape loses its adhesive strength and can be peeled off cleanly and easily.
Product Characteristics
- 1. superior heat resistance of
200℃ × 2hours/260℃ × 10minutes due to special adhesive compounding technology - 2. Peelable without adhesive residue after UV irradiation
- 3. Customization is possible according to customer's request.
Product Details
Main applications
- ・Semiconductor wafer/package dicing
- ・FOWLP/FOPLP reflow process applications
Structures
Properties
| Item | Unit | r.t.,1hr | 200℃ × 2 hours （392℉ × 1hour） |
After UV irradiation |
|---|---|---|---|---|
| Glass | N/25mm | 15.4 | 15.5※ | 0.19 |
| Item | Unit | r.t.,1hr | 260℃ × 10minutes （500℉ × 10minutes） |
After UV irradiation |
|---|---|---|---|---|
| Glass | N/25mm | 15.4 | 19.5※ | 0.18 |
- ・Tape composition: PEN film/heat-resistant UV release adhesive layer/PET Release Liner
- ・UV irradiation conditions: 365nm, 4,000mJ/㎠
- *After heating, return to room temperature environment, then measurement
Please inquire for more information.
Electronic Materials Department
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- Thermal-resistant UV release tape for dicing ISR-TR Series