Machinery / Semiconductors and Automation
Reflow Systems, Screening Systems
Iwatani offers advanced one-stop solutions that encompass all processes encountered in the semiconductor manufacturing sector.
Compact Reflow Systems (Atmospheric or N2 Operations)
Compact Reflow Supporting Industry Smallest Dimensions of 2 M Designed to Dramatically Reduce Operating Costs Ideal for Mass Production, Diverse Low-Volume Production, and Cell Production
We apply thermal control technologies and expertise developed over the years to provide consistent, efficient heating and to ensure reflow soldering heat treatment. These steps help meet the quality and reliability requirements demanded in today’s market. Iwatani will continue to respond to a broad range of customer requirements by developing new applications for compact high performance heating units.
Specifications
| Power Supply | 3-phase, 200 V 18 kVA (18 kW) | |
|---|---|---|
| System Weight | Approx. 500 kg | |
| N2 Supply Rate | At least 250 L/min | |
| 0.4 MPa, purity of at least 99.99% | ||
| Effective Substrate Width | Pin Chain | 50 to 160 mm |
| Mesh (Option) | Max. 160 mm | |
| Feed Type | Pin chain | |
| Feed Speed | 0.1 to 0.5 m/min | |
| Feed Height | 900 mm ±20 mm | |
Features
- Ultra-compact dimensions (space saving)
- Hot air system combined with far-infrared radiation
- Atmospheric air type, N2 type (for high quality)
- Temperature differential heating
- High temperature specifications (350°C setting standard specification)
- Continuous feeding (manpower saving)
- Energy, electricity, and N2 gas savings
- Cleanroom compatible
Main Applications
Heating/temperature control, soldering, high temperature soldering (AnSn, lead-rich bonding), screening, aging, drying, resin (e.g., adhesive, underfill, epoxy)/paste curing, thermal testing, low-temperature sintering
Special Reflow Systems
Can Be Customized to Suit All Kinds of Heating Furnaces Lineup of Industry’s Smallest Single-Zone Heating Furnaces for Drying and Aging, Also Available
High performance heating furnaces to meet customer requirements for all kinds of heating applications. Iwatani’s extensive manufacturing experience makes it possible to cater to a wide range of customer requirements and specifications for transfer jigs, loaders, and unloaders.
Standard Specifications
| Effective Substrate Height | Upper face 15 mm |
|---|---|
| Feed Type | Mesh feed system |
| Maximum Feed Width | 160 mm (mesh only) |
| Feed Speed | 0.03 to 0.15 m/min |
| Pass Line | 900 mm ±20 mm |
| Number of Heater Plates | 2 (1 each above and below) |
| Number of Circulator Fans | 1 |
| Power Supply | 200 V AC, 5 kVA, 15 A |
| Size |
|
| Weight | 150 kg |
Applications
Heating/temperature control, soldering, screening, aging, drying, resin (e.g., adhesive, underfill, epoxy)/paste curing, thermal testing, low-temperature sintering, preheating, testing, evaluating, R&D
Please inquire for more information on reflow systems and screening systems.
Electronic Equipment Department
Tokyo
81-3-5405-5781
Osaka
81-6-7637-3072