Machinery / Semiconductors and Automation
Molding Systems and Dies
Iwatani offers advanced one-stop solutions that encompass all processes encountered in the semiconductor manufacturing field.
Automatic Molding Systems
Lineup of Systems for Applications Ranging from R&D to Full-Scale Production
Iwatani offers solutions to meet specific customer requirements, including systems designed for use with black resin, such as copper and ceramic heat dissipating plate insert molding and vehicle-mounted module molding; systems designed for use with transparent resin supporting lens molding, MAP molding, single-side sealing, and double-side sealing; easy resin replacement systems designed for use with liquid silicone and resin-containing fluorescent material or nano-fillers; and R&D systems using small dies for easy replacement.
Features
- Uses a highly sealed chamber to eliminate non-filled areas and voids.
- Large 100 mm × 300 mm frame capable of handling substrates
- Supports vacuum sealing.
- Supports automatic application of mold releasing agent to ensure consistent quality.
- 60 t and 120 t presses available.
- Proven track record with items such as sensors, connectors, and relays in the semiconductor and electronic component industry
- Offering optimal solutions in conjunction with dies to suit product specifications and production quantities
Hydraulic Conventional Molding Systems
Conventional Transfer Mold Press
Presses from 50 to 250 t are available, covering wide-ranging applications.
Applications
Systems for resin sealing based on the transfer molding process
Used primarily for sealing electronic components
Molding Dies
Allows Machining Down to 1 µM Scales Using State-Of-The-Art Machining Equipment and Refined Technology
Allows die manufacture, from multi-pot dies for automatic molding use to conventional dies for use with hydraulic presses, to accommodate a broad range of product specifications, production quantities, and number of machines deployed.
Applications
- Dies for transparent resin for use in optical sensors
- Dies for black resin for use in semiconductors (TO, IPM, IGBT modules, etc.)
- Conventional dies for use in hydraulic presses
Example Solutions Available
- ECU batch sealing
- Heat sink package sealing
Other molding process solutions are available to meet customer requirements.
Please inquire for more information on molding systems and dies.
Electronics Equipment Department
Tokyo
81-3-5405-5781
Osaka
81-6-7637-3072