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April 08, 2009

Participated in SEMICON CHINA 2009

SEMICON CHINA 2009 was held March 17-19 at the Shanghai New International Expo Center.

 

SEMICON CHINA is a long-standing exhibition that has been displaying and introducing manufacturing equipment and materials and new technologies to the semiconductor and electronic component markets in China since the 1980s. This year the exhibition welcomed approximately 600 participants and 33,000 visitors during its three days.

 

The Iwatani Group operated four booths (36 m2) through collaboration between Shanghai Iwatani Co., Ltd. and Iwatani Electronics (Shanghai) Co., Ltd. and Iwatani Corporation and received visitors from a total of 200 companies. Separate areas were set up for different fields including electronic materials, Front End process, Back End process, electroplating and industrial gas, aiming to raise the profile of products in an easy-to-understand and effective way for the visitors. Particular emphasis was placed on exhibiting products that can contribute to customers’ environmental considerations.

 

 

Exhibition Contents

 

A) Ishihara Chemical Co., Ltd.

Lead-free plating solution

(introduced lead frame-plating solutions that earn the industry’s top share, such as pure tin, tin/ bismuth)

 

B) Abe precision Incorporated (Suzhou) Co., Ltd.  

Precise Tooling

(introduced high-quality precise tooling targeted not only at the semiconductor industry but also the electronic component and vehicle installation industries)

 

C) Rhesca Company Limited

Bonding tester, solder checker

(destruction-testing machine to measure adhesive strength of semiconductor gold wire and wetness-testing machine for surface plating)

 

D) Industrial gas section

High-purity carbon dioxide gas

(introduced applications for surface-scrub process, solvent-exfoliation process and dicing process of high-purity carbon dioxide gas manufactured by Shanghai Petrochem- Iwatani Gases Development Co., Ltd.)

 

E) Solar battery-related

Consumable materials for solar battery module process

(exhibited slurry materials, soldering rectangular wire, backsheet and adhesive tape)

 

F) LED-related materials

Glass epoxy and ceramic boards for LED

(consumable materials for LED – for which explosive demand is expected)